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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/12 tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 14 ? 001 datashee t dc brushless fan motor drivers multifunction single-phase full-wave fan motor driver BD6971FS general description BD6971FS is a 1chip driver that composes h-bridge of power dmos fet. moreover, it is possible to correspond to 5v class motor because it starts from 3.5v. features ? driver including power dmos fet ? speed controllable by dc / direct pwm input ? pwm soft switching ? quick start ? current limit ? lock protection and automatic restart ? rotation speed pulse signal (fg) output package w (typ.) x d (typ.) x h (max.) ssop-a16 6.60mm x 6.20mm x 1.71mm application ? fan motors for general consumer equipment of desktop pc, and projector, etc. absolute maximum ratings parameter symbol limit unit supply voltage vcc 20 v power dissipation pd 812.5 *1 mw operating temperature r ange topr C40 to +100 c storage temperature range tstg C55 to +150 c output voltage vo 20 v output current io 1.0 *2 a rotation speed pulse signal (fg) output voltage vfg 20 v rotation speed pulse signal (fg) output current ifg 10 ma reference voltage (ref) output current iref 5 ma hall bias (hb) output current 1 ihb1 5 ma hall bias (hb) output current 2 ihb2 10 *3 ma input voltage (h+, hC, th, min, cs) vin 7 v junction temperature tj 150 c *1 reduce by 6.5mw/c over ta=25c. (on 70.0mm70.0mm1.6mm glass epoxy board) *2 this value is not to exceed pd. *3 the condition of ta=25c and vcc=12v recommended operating conditions parameter symbol limit unit operating supply voltage range vcc 3.5 to 17.0 v operating input voltage range 1 (h+, hC) (more than vcc=9v) 0 to 7 v operating input voltage range 1 (h+, hC) (less than vcc=9v) vin1 0 to vccC2 v operating input voltage range 2 (th, min) vin2 0 to vref v ssop-a16 downloaded from: http:///
2/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pin configuration pin description p/no. t/name function 1 fg speed pulse signal output terminal 2 hC hall C input terminal 3 hb hall bias terminal 4 h+ hall + input terminal 5 cs output current detection terminal 6 n.c. non-connecting terminal 7 out2 motor output terminal 2 8 rnf output current detecting resistor connecting terminal (motor ground) 9 n.c. non-connecting terminal 10 out1 motor output terminal 1 11 vcc power supply terminal 12 ref reference voltage output terminal 13 th output duty controllable input terminal 14 min minimum output duty setting terminal 15 osc oscillating capacitor connecting terminal 16 gnd ground terminal (signal ground) n.c. must open on the substrate pattern, because this is a non-connecting terminal in ic. block diagram i/o truth table hall input driver output h+ hC out1 out2 fg h l l h hi-z l h h l l h; high, l; low, hi-z; high impedance fg output is open-drain type. osc min th current limit comp vcl ref hb out2 h+ hC fg out1 vcc cs gnd tsd hall bias signal output control logic osc ref quick start rnf pre- driver 1 2 3 4 5 15 7 8 pwm comp pwm comp hall amp hall comp pwm soft switching lock protect n.c. 6 n.c. 1614 13 12 11 9 10 fig.2 block diagram min ref hb out2 h+ hC fg out1 vcc osc cs gnd th rnf 1 2 3 4 5 6 7 15 n.c. n.c. 16 8 14 13 12 11 9 10 fig.1 pin configuration (top view) downloaded from: http:///
3/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics(unless otherwise specified ta=25c, vcc=12v) limit parameter symbol min. typ. max. unit conditions ref. data circuit current icc 3 5 8 ma fig.3 hall input hysteresis + voltage vhys+ 4 9 16 mv fig.4 hall input hysteresis C voltage vhysC C18 C13 C8 mv fig.4 output voltage vo - 0.6 0.9 v io=200ma, high and low side total fig.5 to 8 lock detection on time ton 0.3 0.5 0.7 s fig.9 lock detection off time toff 3.0 5.0 7.0 s fig.10 fg output low voltage vfgl - 0.15 0.30 v ifg=2ma fig.11, 12 fg output leak current ifgl - - 10 a vfg=17v fig.13 osc high voltage vosch 2.3 2.5 2.7 v fig.14 osc low voltage voscl 0.8 1.0 1.2 v fig.14 osc charge current icosc C16 C8 C4 a fig.15 osc discharge current idosc 4 8 16 a fig.15 output on duty 1 poh1 75 80 85 % vth=vref x 0.222 output 1k ? , osc=100pf - output on duty 2 poh2 45 50 55 % vth=vref x 0.294 output 1k ? , osc=100pf - output on duty 3 poh3 15 20 25 % vth=vref x 0.367 output 1k ? , osc=100pf - reference voltage vref 5.8 6.0 6.2 v iref=C2ma fig.16, 17 hall bias voltage 1 vhb1 1.10 1.30 1.50 v ihb=C2ma fig.18, 19 hall bias voltage 2 vhb2 1. 05 1.25 1.48 v ihb=C10ma fig.19 current limit setting voltage vcl 280 310 340 mv fig.20 th input bias current ith - - C0.2 a vth=0v fig.21 min input bias current imin - - C0.2 a vmin=0v fig.22 cs input bias current ics - - C0.2 a vcs=0v fig.23 about a current item, define the inflow cu rrent to ic as a positive notation, and t he outflow current from ic as a negative not ation. downloaded from: http:///
4/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves(reference data) y v[v] c [a] fig.3 circuit current operating range 100c 25c C 40c y v[v] y vy[v] fig.4 hall input hysteresis voltage operating range 100c 25c C 40c 100c 25c C 40c [a] v[v] fig.5 output high voltage (vcc=12v) 100c 25c C 40c [a] v[v] fig.6 output high voltage (ta=25c) 17v 12v 3.5v downloaded from: http:///
5/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves(reference data) y v[v] [] fig.9 lock detection on time operating range 100c 25c C 40c [a] v[v] fig.7 output low voltage (vcc=12v) 100c 25c C 40c [a] v[v] fig.8 output low voltage (ta=25c) 17v 12v 3.5v y v[v] [] fig.10 lock detection off time operating range 100c 25c C 40c downloaded from: http:///
6/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves(reference data) y v[v] [a] fig.13 fg output leak current operating range 100c 25c C 40c [a] v[v] fig.11 fg output low voltage (vcc=12v) 100c 25c C 40c [a] v[v] fig.12 fg output low voltage (ta=25c) 17v 12v 3.5v y v[v] c vv [v] fig.14 osc high/low voltage operating range 100c 25c C 40c 100c 25c C 40c downloaded from: http:///
7/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves(reference data) y v[v] v[v] fig.16 reference voltage operating range 100c 25c C 40c y v[v] c [a] fig.15 osc charge/discharge current operating range 100c 25c C 40c 100c 25c C 40c [a] v[v] fig.17 reference voltage current ability (vcc=12v) 100c 25c C 40c y v[v] v[v] fig.18 hall bias voltage 1 operating range 100c 25c C 40c downloaded from: http:///
8/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves(reference data) y v[v] [a] fig.21 th bias current operating range 100c 25c C 40c y v[v] [a] fig.22 min bias current operating range 100c 25c C 40c [a] v[v] fig.19 hall bias voltage current ability (vcc=12v) 100c 25c C 40c y v[v] c v[v] fig.20 current limit setting voltage operating range 100c 25c C 40c downloaded from: http:///
9/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves(reference data) application circuit example(constant values are for reference) substrate design note a) ic power, motor outputs, and motor ground lines are made as fat as possible. b) ic ground (signal ground) line is common with the applic ation ground except motor grou nd (i.e. hall ground etc.), and arranged near to (C) land. c) the bypass capacitor and/or zenner diode are arrangement near to vcc terminal. d) h+ and hC lines are arranged side by side and made fr om the hall element to ic as shorter as possible, because it is easy for the noise to influence the hall lines. y v[v] c [a] fig.23 cs bias current operating range 100c 25c C 40c fig.24 pwm controllable 4 wires type motor application circuit protection of fg open-drain hall bias is set according to the amplitude of hall element output and hall input voltage range. to limit motor current, the current is detected. note the power consumption of detection resistance. stabilization of ref voltage low-pass filter for rnf voltage smoothing circuit that converts pwm duty into dc voltage noise measures of substrate minimum output duty setting output pwm frequency setting maximum output voltage and current are 20v and 1.0a. so bypass capacitor, arrangement near to vcc terminal as much as p ossible measure against back emf pwm m 0.33 ? to 0.1f to 1f to sig h 200 ? to 20k ? 100pf to 0.01f 0 ? to 0 ? to 47pf to 220pf osc min th current limit comp vcl ref hb out2 h+ hC fg out1 vcc cs gnd tsd hall bias signal output control logic osc ref quick start rnf pre- driver 1 2 3 4 5 15 7 8 pwm comp pwm comp hall amp hall comp pwm soft switching lock protect n.c . 6 n.c. 16 14 13 12 11 9 10 reverse-connected prevention of the fan connector downloaded from: http:///
10/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 power dissipation power dissipation (total loss) indicates the power that can be consumed by ic at ta=25c (normal temperature). ic is heated when it consumes power, and th e temperature of ic chip becomes hi gher than ambient temperature. the temperature that can be accepted by ic chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. power dissipation is determined by the tem perature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is in general equal to the maximum value in the storage temperature range. heat generated by consumed power of ic is radiated from the mold resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardness of heat re lease) is called heat resistance, represented by the symbol ja[c/w]. this heat resistance can estimate the temperature of ic inside the package. fig.25 shows the model of heat resistance of the package. heat resistance ja, ambient temperature ta, junction temperature tj, and power consumption p can be calculated by the equation below: thermal de-rating curve indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambi ent temperature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. thermal de-rating curve indicates a reference value measured at a specified cond ition. fig.26 shows a thermal de-rating curv e (value when mounting fr4 glass epoxy board 70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). thermal resistance jc from ic chip joint part to the package surface part of mounting the above-me ntioned same substrate is shown in the following as a reference value. reduce by 6.5mw/c over 25c (on 70.0mm x 70.0mm x 1.6mm glass epoxy board) i/o equivalence circuit(resistance values are typical) 1) power supply terminal, 2) hall input terminals, 3) minimum output duty setting 4) motor output terminals, and ground terminal output duty controll able input terminal and output current terminal, detecting resistor and output current detec tion connecting terminal terminal 5) reference voltage output 6) speed pulse signal output 7) oscillating capacitor connecting terminal, terminal terminal and hall bias terminal osc vcc 1k ? vcc 1k ? 50 0 75 0 pd[mw] 0 25 50 75 100 125 150 ta[ c ] 25 0 812. 5 ja=153.8 [c/w] ja = (tj C ta) / p [c/w] jc = (tj C tc) / p [c/w] fig.25 thermal resistance fig.26 thermal de-rating curve ja = (tj C ta) / p [c/w] jc = 43 [c/w] (reference value) chip surface temperature tj[c] package surface temperature tc[c] power consumptio n p[w] ambient temperature ta[c] th 1k ? h+ hC cs vcc 10 ? fg vcc out1 out2 rnf vcc gnd ref 46k ? vcc hb 46k ? vcc min 1 k ? vcc 30 ? downloaded from: http:///
11/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to i dentify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. 3) power supply line back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and gnd for routing regener ated current. and fully ensure that the capacitor characteristics have no problem before determine a capaci tor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) gnd potential it is possible that the motor output terminal may deflect below gnd terminal because of influence by back electromotive force of motor. the potent ial of gnd terminal must be minimum po tential in all operating conditions, except that the levels of t he motor outputs terminals are under gnd level by the back electromotive force of the motor coil. also ensure that all terminals except gnd and moto r output terminals do not fall below gnd voltage including transient characteristics. malfunction may possibly occur depending on use condition, environment, and property of individual motor. please make fully confirmati on that no problem is found on operation of ic. 5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. the ic may be damaged if there is any connection error or if pi ns are shorted together. 7) actions in strong electromagnetic field use caution when using the ic in the pr esence of a strong electrom agnetic field as doing so may cause the ic to malfunction. 8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum rations or aso. 9) thermal shut down circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). operation temperatur e is 175c (typ.) and has a hysteresis width of 25c (typ.). when ic chip temperature rises and tsd circuit works, the output terminal becomes an open state. tsd circuit is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operation this circuit or use the ic in an environment where the operation of this circuit is assumed. 10) testing on application boards when testing the ic on an application board, connecting a ca pacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ics power supply off before connecting it to or removing it from a jig or fixture during the inspection proc ess. ground the ic during assembly steps as an antistatic measure. use similar prec aution when transporting or storing the ic. 11) gnd wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the grou nd potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 12) capacitor between output and gnd when a large capacitor is connected between output and gnd, if v cc is shorted with 0v or g nd for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. keep the capacitor between output and gnd below 100f. 13) ic terminal input when vcc voltage is not applied to ic, do not apply voltage to each input terminal. when voltage above vcc or below gnd is applied to the input terminal, para sitic element is actuated due to the st ructure of ic. operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. do not use in a manner where parasitic element is actuated. 14) in use w e are sure that the exampl e of application circuit is pr eferable, but please check the character further more in application to a part that requires high precision. in using the unit with external circuit constant changed, consider the variation of externally equipped parts and our ic including not only static character but also transient character and allow sufficient margin in determining. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document, formal version takes priority. downloaded from: http:///
12/12 datasheet datasheet BD6971FS tsz02201-0h1h0b100160-1-2 ? 2012 rohm co., ltd. all rights reserved. 28.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension tape and reel information marking diagram revision history date revision comments 07.jul.2012 001 new release 28.jul.2012 002 color appearance change (there is no change in the content.) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) ssop-a16 13 87 0.8 9 0.11 15 45 3 11 0.3min 2 12 16 14 6 1 10 6.6 0.2 0.15 0.1 0.36 0.1 1.5 0.1 6.2 0.3 4.4 0.2 (max 6.95 include burr) 0.1 bd6971 f ssop-a16 (top view) part number lot number 1pin mark downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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